PCFAB Products

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Lead Free HASL

SN100CL^® series

Nihon Superior Lead free solder – starter and replenisher alloys for Hot Air Level applications

Nickel 10 additive

High Nickel concentration used when Nickel is low after copper removal (10X greater than SN100CL^®)

HA 300

Florida CirTech Hot Air Flux

ENIG

PC 300

Acid cleaner

CT 300

Catalyst/Activator

EN 300

Electroless Nickel 2 Part system

IG 300

Low Gold concentration Immersion Gold

Process Flow

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Process Parameters

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Immersion Silver

IS 127

Acid Cleaner

IS 150

Immersion Silver pre-dip and main silver bath

IS 175

Silver anti-tarnish

Process Flow

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Process Parameters

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Micro-etches

CirEtch 100

Potassium based persulfate blend

CirEtch 130

Hydrogen Peroxide micro-etch

Uniquie chemical Blends

NS 41

Electroless Nickel stripper (removes Nickel in ENIG process)

NS 41 Process Flow

Hydrogen Peroxide micro-etch

CK 300 Catalyst Killer

Removes Palladium Catalyst to prevent Plating in non-plated thru-holes in ENIG process

VOC-Free Liquid Photoresist

AQ 3000 DC (Dip Coating)

Waterborne Liquid Photoresist

AQ 3000 DC For PCM

Waterborne Liquid Photoresist For Photochemical Machining

AQ 3000 RC (Roller Coating)

Waterborne Liquid Photoresist

AQ 3000 LDI

Laser Direct Imaging Liquid Photoresist

AQ 3000 Benefits

AQ 3000 Waterborne Photoresist Product Highlights